封装:
Surface Mount(97)
SMD(7)
-(18)
(5)
~(2)
0808(1)
插件(1)
SMD,P=1mm(1)
12(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: Conn Unshrouded Header HDR 10POS 2.54mm Solder ST SMD Embossed T/R
    7857
    5-49
    12.5424
    50-199
    12.0064
    200-499
    11.7062
    500-999
    11.6312
    1000-2499
    11.5562
    2500-4999
    11.4704
    5000-7499
    11.4168
    ≥7500
    11.3632
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 14电路, 0.76μm ( 30μ ),金(Au )选择性电镀,无压入塑料钉 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    3103
    5-49
    15.0930
    50-199
    14.4480
    200-499
    14.0868
    500-999
    13.9965
    1000-2499
    13.9062
    2500-4999
    13.8030
    5000-7499
    13.7385
    ≥7500
    13.6740
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式, 8电路, 0.76μm ( 30μ ),金(Au )选择性电镀,无压入塑料钉 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
    7300
    10-99
    8.0760
    100-499
    7.6722
    500-999
    7.4030
    1000-1999
    7.3895
    2000-4999
    7.3357
    5000-7499
    7.2684
    7500-9999
    7.2146
    ≥10000
    7.1876
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( 0.079 ( 15μ帽,磁带和卷轴包装,无铅 2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free
    3169
    10-99
    7.1400
    100-499
    6.7830
    500-999
    6.5450
    1000-1999
    6.5331
    2000-4999
    6.4855
    5000-7499
    6.4260
    7500-9999
    6.3784
    ≥10000
    6.3546
  • 描述: Conn Shrouded Header HDR 12POS 1.5mm Solder RA SMD Embossed T/R
    6217
    5-24
    5.6430
    25-49
    5.2250
    50-99
    4.9324
    100-499
    4.8070
    500-2499
    4.7234
    2500-4999
    4.6189
    5000-9999
    4.5771
    ≥10000
    4.5144
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( .079 “ )间距的Milli-电网插座,表面贴装,顶面入口, 0.38um ( 15U ”),金(Au )镀层 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38um (15u") Gold (Au) Plating
    8214
    10-99
    11.7840
    100-499
    11.1948
    500-999
    10.8020
    1000-1999
    10.7824
    2000-4999
    10.7038
    5000-7499
    10.6056
    7500-9999
    10.5270
    ≥10000
    10.4878
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.40毫米( 0.016 “ )间距SlimStack板对板插座, SMT ,双排,垂直 0.40mm (.016") Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical
    8621
    5-49
    15.3036
    50-199
    14.6496
    200-499
    14.2834
    500-999
    14.1918
    1000-2499
    14.1002
    2500-4999
    13.9956
    5000-7499
    13.9302
    ≥7500
    13.8648
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.00毫米( .079 “ )间距的Milli-电网插座,表面贴装,垂直,顶部/底部进入 2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry
    4280
    5-49
    25.5879
    50-199
    24.4944
    200-499
    23.8820
    500-999
    23.7290
    1000-2499
    23.5759
    2500-4999
    23.4009
    5000-7499
    23.2916
    ≥7500
    23.1822
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: CONN RECEPT 72POS 1.2MM VERT SMD
    8119
    1-9
    155.3995
    10-49
    151.3456
    50-99
    148.2376
    100-199
    147.1566
    200-499
    146.3458
    500-999
    145.2648
    1000-1999
    144.5891
    ≥2000
    143.9135
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 线至板连接器, 1.5 mm, 7 触点, 针座, Pico-SPOX 87437 Series, 表面安装 , 1 排
    8863
    5-24
    3.1725
    25-49
    2.9375
    50-99
    2.7730
    100-499
    2.7025
    500-2499
    2.6555
    2500-4999
    2.5968
    5000-9999
    2.5733
    ≥10000
    2.5380
  • 描述: 1.00毫米( .039 “ )间距夹层IEEE 1386插座,表面贴装,双排,垂直叠加 1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row, Vertical Stacking
    1514
    1-9
    40.9554
    10-99
    38.6055
    100-249
    36.8599
    250-499
    36.5913
    500-999
    36.3227
    1000-2499
    36.0206
    2500-4999
    35.7521
    ≥5000
    35.5842
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 1.00毫米( .039 )间距夹层IEEE 1386插件,表面贴装,双排,垂直叠加, 64电路, 8.35毫米( 0.329 )未交配高度,没有PCB定位器衣夹 1.00mm (.039) Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, Vertical Stacking, 64 Circuits, 8.35mm (.329) Unmated Height, without PCB Locator Pegs
    5196
    5-49
    34.6554
    50-199
    33.1744
    200-499
    32.3450
    500-999
    32.1377
    1000-2499
    31.9304
    2500-4999
    31.6934
    5000-7499
    31.5453
    ≥7500
    31.3972
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 2.54毫米( .100 )间距SLA ?? ¢线对板头,扁平,表面贴装,单列,直角, 0.120口袋,带罩,带压入塑料钉, 2个电路 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits
    2178
    5-49
    14.4144
    50-199
    13.7984
    200-499
    13.4534
    500-999
    13.3672
    1000-2499
    13.2810
    2500-4999
    13.1824
    5000-7499
    13.1208
    ≥7500
    13.0592
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 100电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 100 Circuits
    4291
    1-9
    39.6988
    10-99
    37.4210
    100-249
    35.7289
    250-499
    35.4686
    500-999
    35.2083
    1000-2499
    34.9154
    2500-4999
    34.6551
    ≥5000
    34.4924
  • 描述: 0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 60电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 60 Circuits
    9333
    5-49
    24.7806
    50-199
    23.7216
    200-499
    23.1286
    500-999
    22.9803
    1000-2499
    22.8320
    2500-4999
    22.6626
    5000-7499
    22.5567
    ≥7500
    22.4508
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 40电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 40 Circuits
    7857
    5-49
    14.3559
    50-199
    13.7424
    200-499
    13.3988
    500-999
    13.3130
    1000-2499
    13.2271
    2500-4999
    13.1289
    5000-7499
    13.0676
    ≥7500
    13.0062
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.635 PITCH B- TO- B插头HSG盖组件-LEAD FREE- 0.635 PITCH B-TO-B PLUG HSG COVER ASSY -LEAD FREE-
    4839
    1-9
    56.9862
    10-99
    53.7165
    100-249
    51.2876
    250-499
    50.9139
    500-999
    50.5402
    1000-2499
    50.1198
    2500-4999
    49.7462
    ≥5000
    49.5126
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.635毫米( 0.025 “ )间距SlimStack ™接头,表面贴装,双排, VerticalStacking , 6.00和12.00毫米( 0.236和0.472 ” )堆叠高度,黑色,无铅, 60Circuits ,机器人放置金属盖,用浮雕胶带卷轴包装 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 6.00 and 12.00mm (.236 and .472") Stacking Heights, Black, Lead-free, 60Circuits, Robotic Placement Metal Cap, with Embossed Tape on Reel Packaging
    9954
    5-49
    24.3360
    50-199
    23.2960
    200-499
    22.7136
    500-999
    22.5680
    1000-2499
    22.4224
    2500-4999
    22.2560
    5000-7499
    22.1520
    ≥7500
    22.0480
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: CONN RCPT 60POS 10.5MM 0.5MM SMD
    6349
    1-9
    48.0558
    10-99
    45.2985
    100-249
    43.2502
    250-499
    42.9351
    500-999
    42.6200
    1000-2499
    42.2655
    2500-4999
    41.9504
    ≥5000
    41.7534
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 50电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 50 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    7434
    5-49
    15.4908
    50-199
    14.8288
    200-499
    14.4581
    500-999
    14.3654
    1000-2499
    14.2727
    2500-4999
    14.1668
    5000-7499
    14.1006
    ≥7500
    14.0344
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 22电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 22 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    7810
    10-99
    8.7240
    100-499
    8.2878
    500-999
    7.9970
    1000-1999
    7.9825
    2000-4999
    7.9243
    5000-7499
    7.8516
    7500-9999
    7.7934
    ≥10000
    7.7644
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直, 1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 20电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical,1.50mm (.059") Stacking Height, Lower Circuit Size Version, 20 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    1581
    10-99
    8.9160
    100-499
    8.4702
    500-999
    8.1730
    1000-1999
    8.1581
    2000-4999
    8.0987
    5000-7499
    8.0244
    7500-9999
    7.9650
    ≥10000
    7.9352
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 70电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 70 Circuits
    8323
    5-49
    33.8598
    50-199
    32.4128
    200-499
    31.6025
    500-999
    31.3999
    1000-2499
    31.1973
    2500-4999
    30.9658
    5000-7499
    30.8211
    ≥7500
    30.6764
  • 描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 40电路,镀金镍屏障板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical 1.50mm (.059") Stacking Height, Lower Circuit Size Version, 40 Circuits, Gold Plating with Nickel Barrier Plating Between Contact and Tail
    7434
    5-49
    12.4839
    50-199
    11.9504
    200-499
    11.6516
    500-999
    11.5770
    1000-2499
    11.5023
    2500-4999
    11.4169
    5000-7499
    11.3636
    ≥7500
    11.3102
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 80电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 80 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    2943
    5-49
    25.7751
    50-199
    24.6736
    200-499
    24.0568
    500-999
    23.9026
    1000-2499
    23.7483
    2500-4999
    23.5721
    5000-7499
    23.4620
    ≥7500
    23.3518
  • 描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 60电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical 1.50mm (.059") Stacking Height, Lower Circuit Size Version, 60 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    3775
    5-49
    15.3153
    50-199
    14.6608
    200-499
    14.2943
    500-999
    14.2027
    1000-2499
    14.1110
    2500-4999
    14.0063
    5000-7499
    13.9409
    ≥7500
    13.8754
  • 描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 30电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 30 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    4647
    10-99
    8.8200
    100-499
    8.3790
    500-999
    8.0850
    1000-1999
    8.0703
    2000-4999
    8.0115
    5000-7499
    7.9380
    7500-9999
    7.8792
    ≥10000
    7.8498
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.5 B- TO -B CONN REC HOUSING组件( HGT - 1.5 ) ( 1页,共2 ) 0.5 B-TO-B CONN REC HOUSING ASSY (HGT-1.5) (SHEET 1 OF 2)
    4153
    5-49
    29.1330
    50-199
    27.8880
    200-499
    27.1908
    500-999
    27.0165
    1000-2499
    26.8422
    2500-4999
    26.6430
    5000-7499
    26.5185
    ≥7500
    26.3940
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 120电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 120 Circuits
    6694
    5-49
    34.9362
    50-199
    33.4432
    200-499
    32.6071
    500-999
    32.3981
    1000-2499
    32.1891
    2500-4999
    31.9502
    5000-7499
    31.8009
    ≥7500
    31.6516
  • 品牌: Molex (莫仕)
    封装: Surface Mount
    描述: 0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 16电路,金(Au)镀镍( Ni)的阻挡板之间联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 16 Circuits, Gold (Au)Plating with Nickel (Ni) Barrier Plating Between Contact and Tail
    8950
    10-99
    8.2920
    100-499
    7.8774
    500-999
    7.6010
    1000-1999
    7.5872
    2000-4999
    7.5319
    5000-7499
    7.4628
    7500-9999
    7.4075
    ≥10000
    7.3799

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